Abstract Scope |
Additive manufacturing has transformed the creation of ceramic-polymer composites like Silicon Carbide (SiC), offering lighter weight, toughness, and excellent thermal properties. Vat polymerization techniques, such as Digital Light Processing (DLP), stand out for achieving high dimensional accuracy, making them ideal for intricate parts. However, integrating ceramic particles into photosensitive resin poses challenges, requiring precise tuning of particle concentration and size to ensure proper dispersion. This is especially crucial for monolithic sintered ceramic parts, where high ceramic loading prevents defects. The opacity of ceramic particles also alters resin optics, affecting the curing process, and requiring careful light exposure adjustments. Despite advancements, a knowledge gap remains in processing high solid loading SiC suspensions for photopolymerization. This study successfully developed high solid loading SiC-polymer resins for DLP, optimizing viscosity, stability, and curing parameters. Results showed enhanced compressive strength and thermal conductivity with increased solid loading, demonstrating the material’s potential for advanced 3D-printed applications. |