| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Solid Phase Processing Symposium
|
| Presentation Title |
Electrical Conductivity and Wear Properties of Pure Copper Processed by High Pressure Sliding |
| Author(s) |
Evander Ramos, Takahiro Masuda, Yoichi Takizawa, Zenji Horita, Suveen Mathaudhu |
| On-Site Speaker (Planned) |
Evander Ramos |
| Abstract Scope |
A variety of severe plastic deformation approaches, such as high-pressure torsion, have been used to apply large strains, and thus engender extreme grain refinement in metallic materials, however scalability has often been limited. In this study, high pressure sliding (HPS), a linear analog of high-pressure torsion, has been utilized to process high purity copper under ambient high-shear, large strain conditions. The influence of this processing on the microstructure, electrical conductivity, and mechanical properties has been explored. These properties are compared to the literature for copper processed by well-established SPD methods to validate the viability of HPS as a scalable SPD process. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |