| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Effect of Epoxy Material and Gold Wire Configuration on Light-emitting Diode Encapsulation Process |
| Author(s) |
Mohd Sharizal Abdul Aziz, Jing Qi Chooi, C.Y. Khor, Xing Qi Lim, M.H.H. Ishak, Mohd Arif Anuar Mohd Salleh |
| On-Site Speaker (Planned) |
Mohd Sharizal Abdul Aziz |
| Abstract Scope |
This paper investigated the impacts of epoxy material and different gold wire configurations on the total maximum deformation, maximum von Mises stress, and maximum equivalent elastic strain on the Light-Emitting Diode (LED) encapsulation process. The simulation of the LED encapsulation process employed the Volume of Fluid (VOF), Fluid-Structure Interaction (FSI), and System Coupling methods within the ANSYS software. The simulation results of an epoxy molding compound (EMC) with a viscosity of 0.448 kg/ms were validated by an experiment. A grid-independent test was run to determine the minimum mesh refinement required for the simulation. The results revealed that the final fluid profile of the EMC at 0.448 kg/ms formed closely to the experimental results compared with the other epoxies. The overall best performance of the wire configuration to the EMC on the LED encapsulation process listed in ascending order was Square-loop, Triangle-loop, S-loop, Q-loop, and M-loop. This study contributes to understanding the effects of epoxy material and various gold wire configurations on key mechanical parameters in the Light-Emitting Diode (LED) encapsulation process. Hence, guiding LED manufacturers in selecting optimal epoxy materials and wire configurations to improve the reliability and performance of LED encapsulation processes |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Modeling and Simulation, Electronic Materials, Shaping and Forming |