| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Chemistry and Physics of Interfaces
|
| Presentation Title |
Examining the Interactions of Crack Tips With Disconnections in Copper Twin Boundaries |
| Author(s) |
Ethan R. Cluff, Remi Dingreville, Eric R. Homer |
| On-Site Speaker (Planned) |
Ethan R. Cluff |
| Abstract Scope |
While previous atomistic studies of crack tip propagation have studied the behavior of cracks propagating through flat grain boundaries (GBs), this work demonstrates that the presence of disconnections in GBs changes the behavior of a propagating crack tip. Changes in disconnection character, such as step height and dislocation character, also affect propagation behavior. At low temperatures, the presence of a disconnection resulted in higher initial crack tip velocity but lower total propagation. At high temperatures, these differences become less pronounced. The results varied significantly depending on the selected interatomic potential.
Sandia National Laboratories is a multimission laboratory managed and operated by National Technology and Engineering Solutions of Sandia, LLC., a wholly owned subsidiary of Honeywell International, Inc., for the US DOE’s NNSA under contract DE-NA-0003525. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Modeling and Simulation, Thin Films and Interfaces, Computational Materials Science & Engineering |