| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials II
|
| Presentation Title |
Reliability and Lifetime Predictions of Fine Pitch Ball Grid Arrays in Thermal Cycling |
| Author(s) |
Hannah Fowler, Ryan Smith, Robert Buarque de Macedo, Joshua Minster, Deborah Hagen, Jessica Buckner |
| On-Site Speaker (Planned) |
Hannah Fowler |
| Abstract Scope |
Long-term reliability of solder interconnects improves electronic device lifetimes. In particular, the reliability of fine-pitch ball grid arrays (BGAs) is of interest because of their small space requirements and high interconnect density. Unfortunately, BGAs are prone to solder joint fractures due to thermal stresses, flexing, and vibration. This study focuses on the reliability of Sn-Ag-Cu (SAC305) solder in 0.4mm, 0.65mm, and 0.8mm fine-pitch BGAs during thermal cycling from −55°C to 125°C. Two sets of boards were placed in a thermal cycle chamber. In one set, BGAs were cycled to failure using event detection software. In the other, boards were removed from the chamber and shear tested at 0, 500, 1000, 2500, and 4000 cycles to observe changes in shear stress and failure mode. Experimental data was compared to lifetime predictions in finite element analysis to provide experimental basis for model validation.
Sandia National Laboratories managed and operated under contract DE-NA0003525. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Other, Mechanical Properties |