| About this Abstract |
| Meeting |
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
|
| Symposium
|
2023 Annual International Solid Freeform Fabrication Symposium (SFF Symp 2023)
|
| Presentation Title |
A Pilot Study on Temperature Monitoring and Morphology of the Meltpool in EB-PBF of Copper using Numerical and Analytical Models |
| Author(s) |
Elmira Sharabian |
| On-Site Speaker (Planned) |
Elmira Sharabian |
| Abstract Scope |
In this research, a pilot study on temperature monitoring of electron-beam powder bed fusion of copper has been investigated. Two different methods including an analytical model and a numerical simulation were tested to estimate the temperature and morphology of the meltpool. The analytical model was developed based on process parameters (beam power and speed) and thermophysical properties of the material. The analytical heat transfer model was developed for copper and the results were compared with numerical outcomes. Experimental tests were used to verify both the analytical and numerical models. Results demonstrated that the developed analytical model containing the conduction of the material has great accuracy. Statistical analysis showed process parameters have a significant effect on morphology of meltpool and temperature. The proposed model and simulation can be useful to predict the meltpool morphology which drives the bonding quality of the subsequent layer and the overall quality of the printed parts. |
| Proceedings Inclusion? |
Definite: Post-meeting proceedings |