| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Development of Low-temperature Cu-to-Cu Direct Bonding Technology Using Glycerol Vapor as Cu Surface Antioxidant |
| Author(s) |
Jeehoo Na, Eunhye Lee, So Jeong Lee, Dongwoo Lee, Tae-Ik Lee |
| On-Site Speaker (Planned) |
Jeehoo Na |
| Abstract Scope |
As the current scaling-down technology of semiconductor devices reaches its physical limits, 3D stacking packaging technology is emerging. In the 3D packaging bonding process, Cu-to-Cu direct bonding is gaining prominence because it has the advantage of excellent electrical conductivity and no intermetallic compounds, which can improve electrical and mechanical reliability simultaneously. However, the disadvantage is that the surface of Cu is prone to oxidation during the thermal compression bonding process. In this study, we developed a low-temperature Cu-to-Cu direct bonding technology using glycerol vapor to prevent Cu surface oxidation. Glycerol was used as an environmentally friendly reducing agent to prevent metal oxidation. By injecting glycerol vapor during the thermo-compression bonding, the technology was developed to prevent oxidation of the Cu surface. The bonded surface was observed by EDS analysis to confirm the degree of oxidation of Cu, and mechanical reliability was evaluated by a shear strength test. |
| Proceedings Inclusion? |
Planned: |