About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
Strain-controlled High-cycle Fatigue of Solder Joints for High-reliability Environments |
| Author(s) |
David J. Kemmenoe, John Laing, Benjamin C White |
| On-Site Speaker (Planned) |
David J. Kemmenoe |
| Abstract Scope |
Modern computer-controlled flight systems depend on the integrity of soldered joints over long times under repeated vibrational loading and yet, very little mechanically loaded high-cycle fatigue data on high-reliability SnPb solder joints exists in the open literature. This talk describes our efforts to fill this gap with 12 Hz fully-reversed strain-controlled high-cycle fatigue experiments on OHFC copper butt joints with eutectic SnPb and SAC 396 solders. Joint failures occurred across a range of 100-1,000,000 cycles to failure. Efforts were made to correlate fatigue initiation sites with micro- & macro-defects.
SNL is managed and operated by NTESS under DOE NNSA contract DE-NA0003525 |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Mechanical Properties |