| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
The Formation of Ag Nodule Structures From Ag-Si Metastable States |
| Author(s) |
Koji S. Nakayama, Minoru Ueshima, Masahiko Nishijima, Chuantong Chen, Katsuaki Suganuma |
| On-Site Speaker (Planned) |
Koji S. Nakayama |
| Abstract Scope |
The eutectic alloy of Au-Si has received attention for a bonding technology because it has the advantages of low thermal expansion coefficient, high mechanical strength, and high electrical conductivity. However, the noble metal of Au is limited by cost, which prevents its wide application as a bonding material. We study the metastable states of a rapidly quenched Ag-Si alloy. We find that the amorphous state of Si is formed by the eutectic phase separation, and that the unprecedented growth of crystalline Ag nodules on the particles is thermally activated above 250 °C in the presence of oxygen. The key to nodule formation is that the solute Si in the Ag matrix of the solid solution reacts with oxygen to form silicon monoxide. The growth of nodules with high crystallinity builds a bridge between Ag-Si particles, indicating the possibility of use as a bonding material. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, Powder Materials |