| About this Abstract |
| Meeting |
2020 TMS Annual Meeting & Exhibition
|
| Symposium
|
Advanced Microelectronic Packaging, Emerging Interconnection Technology and Pb-free Solder
|
| Presentation Title |
Low Temperature Polyimide-to-polyimide Direct Bonding with Low Curing Temperature Polyimide Films |
| Author(s) |
Hung-Che Liu |
| On-Site Speaker (Planned) |
Hung-Che Liu |
| Abstract Scope |
Nowadays, the requirement of the performance on microelectronic device become higher while the size of joints need to be shrunk. Cu direct bonding appears to be the solution for ultra-fine pitch packaging, in which hybrid bonding with passivation has been carried out simultaneous with Cu direct bonding. Cu/polyimide hybrid bonding is a promising technology to fabricate 3D integrated microsystems with ultra-fine pitch.
Low temperature hybrid bonding need not only low temperature copper direct bonding but also dielectric layer direct bonding. Polyimide is a commonly-used dielectric material. However, surface activation needs to be done for the fully cured polyimide.
In this study, we use partially cured polyimide films for direct bonding, so that no surface activation is needed. We use thermal bonding to finish bonding process. We successfully bond polyimide films at 250℃ for 30 min. |
| Proceedings Inclusion? |
Planned: Supplemental Proceedings volume |