| About this Abstract |
| Meeting |
2025 TMS Annual Meeting & Exhibition
|
| Symposium
|
Nano and Micro Additive Manufacturing
|
| Presentation Title |
Mechanics of Cracking and Delamination of 3D-Printed Metallic Films for Printed Microelectronics |
| Author(s) |
Chunshan Hu, Sanjida Jahan, Rahul Panat |
| On-Site Speaker (Planned) |
Chunshan Hu |
| Abstract Scope |
Fabrication of reliable thin films and interconnects is crucial for microelectronic devices. Significant attention has focused on cracking and delamination in films made via lithography. New microfabrication techniques now enable on-demand thin film production on various substrates. The unique formation mechanisms and failure behaviors of these methods remain unexplored. This study uses Aerosol Jet 3D nano-Printing (AJP) to fabricate gold films on ceramic substrates, revealing new failure mechanisms. We identify four stress sources: printing, drying, sintering, and cooling and our findings indicate cracking occurs during drying, influenced by binder conditions, while delamination is substrate-dependent. When printing below the glass transition temperature (Tg) of binders, drying-induced capillary stress dominates, leading to the classic 'mud-cracking' model. Printing at temperatures where binders decompose results in cracks driven by thermal expansion mismatches. Printing near Tg enhances strain tolerance, avoiding cracking. These insights inform cracking and delamination mechanism maps for printed thin films. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Thin Films and Interfaces, Characterization |