About this Abstract |
Meeting |
2024 ASC Technical Conference, US-Japan Joint Symposium, D30 Meeting
|
Symposium
|
2024 ASC Technical Conference, US-Japan Joint Symposium, D30 Meeting
|
Presentation Title |
Thermal and Pressure Modeling in Laser-Assisted Automated Fiber Placement |
Author(s) |
Samuel Choi, Mehran Tehrani |
On-Site Speaker (Planned) |
Samuel Choi |
Abstract Scope |
Thermoplastic composites (TPCs) are becoming increasingly popular in the aerospace industry for their out-of-autoclave processing, ease of repair, and fastener free assembly. Their adoption is partly propelled by their laser-assisted Automated Fiber Placement (AFP), enabling quicker and more energy-efficient layup and consolidation. However, optimizing AFP parameters is costly and time-consuming. Finite Element Analysis (FEA) proves vital in understanding and improving the bonding process, essential for efficient TPC production. This paper addresses effects of combined thermal and pressure histories in AFP by developing an integrated model. A ray tracing program is used to precisely define the laser heating profile for both the tape being applied and the base material, which is key for successful in situ consolidation. Additionally, pressure profile under the flexible AFP roller is captured with FEA. Overall, this work seeks to develop of an advanced FEA model that includes detailed analyses of thermal and pressure dynamics, critical for assessing the uniformity and strength of the bonds in resulting TPCs. The model's ability to provide accurate thermal and pressure data enhances our ability to predict the quality of TPC structures made with AFP. As a result, the findings of this paper could encourage wider use of TPCs in aerospace, providing a better understanding that improves predictions of bonding quality during manufacturing. |
Proceedings Inclusion? |
Definite: Post-meeting proceedings |