| About this Abstract |
| Meeting |
2024 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials
|
| Presentation Title |
A-35: Wetting Kinetics and Microstructure of Micro-textured Surface Modified Copper Substrate During Soldering |
| Author(s) |
Juyana A. Wahab, Mohd Arif Anuar Mohd Salleh, Siti Faqihah Roduan, Nurul Aida Husna Mohd Mahayuddin, Dewi Suriyani Che Halin, Rita Mohd Said |
| On-Site Speaker (Planned) |
Juyana A. Wahab |
| Abstract Scope |
A micro-textured surface modified copper substrate for solderable surface is introduced. The dimple micro-texture was fabricated on the copper substrate through a laser surface texturing process. The dimple diameter and the dimple spacing was fixed at of 50 μm and 100 μm, respectively. The effect of laser texturing and micro-textured copper substrate on wetting kinetics and microstructure of the solder paste was investigated. Advance characterisation technique such as synchrotron imaging for in-situ microstructure and wettability interactions using the solderability test was performed. In this study, it was confirmed that the dimple textured substrate had a smaller spreading area compared to the non-textured substrate. The interfacial IMC for dimple textured substrate was observed to be higher than non-textured substrate. The dimpled surface has higher surface roughness and results to the molten solder alloys take more time to flow into cavities before it can further spread on the substrate. |
| Proceedings Inclusion? |
Planned: |