| Scope |
Realization of the full benefit of next generation design requires integration of computational materials engineering models with structural design and lifing models. Conceptually, Integrated Computational Materials Engineering (ICME) spans an extremely broad technical area, from alloy composition through complex processing and resultant microstructures, culminating with the many physical, mechanical, and life-related properties that must be determined with statistical precision. And, of course, to realize the full potential of the ICME vision as described, the many models and facets of ICME must be integrated, validated, and compatible – not just within the materials engineering discipline, but with the analytical tools of other engineering disciplines. Considering the many classes of materials, processes, properties of interest, and component applications, it seems this is a very ambitious challenge. There are the substantial challenges of model development, generation of requisite supporting data, accuracy, validation, integration, and finally (but by no means least challenging) – acceptance. Yet previous efforts and studies have demonstrated the value of ICME and multidisciplinary design optimization utilizing ICME is currently in use in many industries ranging from aerospace to heavy industry to consumer products.
This symposium will provide an opportunity for the materials community to hear from ICME customers across a wide range of industries. Speakers will describe the application of ICME across the entire design-build-test-sustain process. Examples of the application of ICME to reduce the amount of materials testing required for Design Curve generation as well as the role of the Materials Handbook in an age of ICME will be provided. In addition, methods to take credit within the design process for the capability of ICME models to provide estimates of residual stress and other processing features will be presented. Finally, the important issue of ICME model validation requirements within a design process will be a discussed. |