| About this Abstract |
| Meeting |
2022 TMS Annual Meeting & Exhibition
|
| Symposium
|
Powder Materials Processing and Fundamental Understanding
|
| Presentation Title |
Electromigration Behavior of Additively Manufactured Copper Wirings |
| Author(s) |
Hugo Ramirez Grijalba, Ping-Chuan Wang, Dan Freedman |
| On-Site Speaker (Planned) |
Hugo Ramirez Grijalba |
| Abstract Scope |
Characterized by its excellent electrical and thermal conductivities, copper is widely used in the electronics industry for circuitry and thermal management applications. As it becomes more readily available as a material of choice for additive manufacturing (AM), wide adoption of AM copper components can be anticipated to produce complicated designs that are otherwise costly or even impossible to realize. In this study, AM copper wirings are fabricated using bound metal deposition on a Desktop Metal Studio system, where the microstructure is characterized with scanning electron microscopy and electron backscatter diffraction at different stages through the debinding and sintering processes. Electromigration, a degradation process in circuit interconnects due to biased mass depletion under excessive electrical current, is applied to the specimens at various stress conditions to investigate the wear-out process and mechanism. The relationship among the microstructure, surface morphology, and electromigration behavior will be discussed in this presentation. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Additive Manufacturing, Copper / Nickel / Cobalt, Characterization |